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By Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)

ISBN-10: 1441957677

ISBN-13: 9781441957672

ISBN-10: 1441957685

ISBN-13: 9781441957689

Advanced turn Chip Packaging offers prior, current and destiny advances and traits in parts reminiscent of substrate expertise, fabric improvement, and meeting strategies. turn chip packaging is now in frequent use in computing, communications, purchaser and car electronics, and the call for for turn chip know-how is constant to develop with a view to meet the necessity for items that provide higher functionality, are smaller, and are environmentally sustainable.

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A substance that is fat soluble and stable, and that has a route of exposure to a specific organism may bioaccumulate. The third draft of the European Parliament and Council Directive on Waste Electrical and electronic Equipment, presented in 1999, required that member states phase out the use of PBBs and PBDEs by January 1, 2004. Environmentally friendly flame-retardant plastics containing no toxic flame retarding additives such as halogen (bromine) compounds and phosphorus compounds have been developed for electronic products [10].

5Cu solders [14]. 2 Technology Trends: Past, Present, and Future 33 Fig. 0 mm) and macro (1–20 mm) scales. The macro voids are a result of entrapment of flux (for solder paste or ball drop) or plated volatiles (on electroplated solders). 8 shows an example of a plated solder which was reflowed upside down, resulting in volatile entrapment at the UBM—solder interface. Kirkendall voids are small voids which form during thermal aging. They start as microvoids within the Cu3Sn IMC or at the Cu—Cu3Sn interface when Cu is top layer of UBM, such as Cu OSP in the organic laminate.

7 Soft Error and Alpha Emission A soft error is a signal or datum which is wrong. After observing a soft error, there is no implication that the system is any less reliable than before. Soft error rate (SER) is the rate at which a device or system encounters or is predicted to encounter soft errors. It is typically expressed as either number of failures-in-time (FIT), or 34 E. Perfecto and K. Srivastava mean-time-between-failures (MTBF). The unit adopted for quantifying failures in time is called FIT, equivalent to 1 error per billion hours of device operation.

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Advanced Flip Chip Packaging by Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)


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