By Fred Roozeboom (auth.), Fred Roozeboom (eds.)
Rapid thermal and built-in processing is an rising single-wafer know-how in ULSI semiconductor production, electric engineering, utilized physics and fabrics technology. the following, the physics and engineering of this know-how are mentioned on the graduate point. 3 interrelated parts are lined. First, the thermophysics of photon-induced annealing of semiconductor and similar fabrics, together with basic pyrometry and emissivity matters, the modelling of reactor designs and techniques, and their relation to temperature uniformity. moment, method integration, treating the advances in uncomplicated apparatus layout, scale-up, built-in cluster-tool apparatus, together with wafer cleansing and built-in processing. 3rd, the deposition and processing of skinny epitaxial, dielectric and steel motion pictures, protecting selective deposition and epitaxy, built-in processing of layer stacks, and new parts of capability program, akin to the processing of III-V semiconductor buildings and skinny- movie head processing for high-density magnetic facts storage.
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Advances in Rapid Thermal and Integrated Processing by Fred Roozeboom (auth.), Fred Roozeboom (eds.)